Base thickness and warping measurement device
The thickness and warping of the base will be measured in units of 1/100 mm.
The substrate measurement device controls a two-axis stepping motor with a computer to measure the thickness and warpage of the substrate in units of 1/100 mm. At the same time, it displays graphs on the screen and processes the data. It is composed of a distance displacement sensor, X-Y numerical control, a high-rigidity table, and precision LM guides. CKO Corporation designs, manufactures, processes, assembles, and controls automated machines, dedicated machines, and labor-saving machines. We manufacture and provide custom-made machines tailored to our customers' requests. CKO Corporation has established a quick and flexible system to respond to our customers' market needs, allowing us to accommodate short delivery times. We have a track record of approximately 1,000 items delivered, covering a wide range of machine manufacturing. For more details, please contact us or refer to our catalog.
- Company：ＣＫＯ
- Price：Other
